Hiring Freshers for Commissioning EngineerFull-time

Opportunity Details :

We are pleased to present an opportunity for students from your esteemed institution to be considered for the role of Commissioning Engineer under  (Indian Railways – Train Collision Avoidance System), executed by HBL.

We aim to hire approximately 100 fresh engineering graduates from Tier-2 engineering colleges across multiple project locations in India.

Training & Deployment

• Selected candidates will undergo a two-month structured training program in Hyderabad.

• The program includes intensive technical training followed by a refresher training after six months.

• Accommodation during the Hyderabad training period will be provided by the client.

• Post-training, candidates will be deployed at project locations including:

• Shared accommodation will be provided at all project locations.

Eligibility Criteria

• Diploma / B.Tech in Electronics & Communication (ECE) or Electrical & Electronics Engineering (EEE)

• Minimum academic performance of 6.5 GPA or 60% and above

• 2024, 2025 & 2026 pass-outs

• Willingness to work in railway field environments (signaling systems and locomotives)

• Proficiency in English and Hindi

Compensation & Benefits

• Salary: ₹25,000 – ₹30,000 per month (₹3–4 LPA TCC, location dependent)

• Provident Fund (PF) and Health Insurance

• Shared accommodation, Travel Allowance (TA) & Daily Allowance (DA)

Role Exposure

Candidates will gain hands-on exposure to:

• Railway Signaling & Telecom systems

• Testing and Commissioning activities

• Industry practices such as SIPs, TOCs, I-FAT, and C-FAT

Comprehensive training will be provided prior to project deployment.

Internship Option (2026 Pass-outs)

Students graduating in 2026 may be onboarded as Interns:

• Stipend: ₹15,000 per month

• Accommodation, TA & DA will be provided

• Upon successful completion of the internship, compensation will be regularized to ₹3 LPA

Bond & Selection Process

• Selected candidates will be required to sign a 2-year service bond prior to offer release.

Interview Process:

1. Technical Written Test

2. HR Interview